Jump to content

Specific Process Knowledge/Lithography/CSAR: Difference between revisions

Tigre (talk | contribs)
Tigre (talk | contribs)
Line 484: Line 484:


=== wafer 4.09 ===
=== wafer 4.09 ===
{| class="wikitable collapsible collapsed"
! Simple collapsible table
|-
| Lorem ipsum dolor sit amet
|}


The e-beam exposures presented here are written with 'SHOT A,10', i.e. a shot pitch of 5nm; this pitch works very well for large structures but not so well for 20nm or below. To illustrate this, ACHK screenshot are presented along with SEM inspection picures.
The e-beam exposures presented here are written with 'SHOT A,10', i.e. a shot pitch of 5nm; this pitch works very well for large structures but not so well for 20nm or below. To illustrate this, ACHK screenshot are presented along with SEM inspection picures.
Line 539: Line 545:
|09-07-2014, TIGRE
|09-07-2014, TIGRE
|-
|-
|}
{| class="wikitable collapsible collapsed"
|A normal cell in the header row
! colspan="2"| Header cell spans two cols
|-
| colspan="2" | Lorem ipsum dolor sit amet
| Separate body cell
|}
|}