Specific Process Knowledge/Lithography/CSAR: Difference between revisions
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|E-beam exposure | |E-beam exposure | ||
|JEOL 9500 E-2 | |JEOL 9500 E-2 | ||
|0.2 nA, aperture 5, dose 180-420 muC/cm2, | |0.2 nA, aperture 5, dose 180-420 muC/cm2, Shot pitch 7-27 nm | ||
|TIGRE | |TIGRE | ||
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| Line 377: | Line 377: | ||
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|-style="background:Black; color:White" | |-style="background:Black; color:White" | ||
!colspan="4"| | !colspan="4"|Wafer 6.13, 30 nm exposed pattern, shot pitch 7 nm | ||
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