Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

Revision as of 19:48, 28 January 2008 view source 192.38.87.36 (talk) →Etch rates: Empirical formula (Seidl et al) ← Older edit		Revision as of 19:48, 28 January 2008 view source 192.38.87.36 (talk) →Etch rates: Empirical formula (Seidl et al) Newer edit →
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	where k<sub>0</sub> = 2480 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.595 eV for Si(100)		where k<sub>0</sub> = 2480 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.595 eV for Si(100)

	and k<sub>0</sub> = 4500 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.60 eV for Si(110)		and k<sub>0</sub> = 4500 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.60 eV for Si(110)