Specific Process Knowledge/Etch/Wet Chromium Etch: Difference between revisions
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==Wet etching of Chromium== | ==Wet etching of Chromium== | ||
[[Image: | [[Image:Fumehood1-2.jpg|300x300px|thumb|Fume hood 01 or 02 (for acids and bases) in cleanroom D-3 can be used for wet chromium etching.]] | ||
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom B-1 or D-3. You can see the APV [http://labmanager | Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom B-1 or D-3. You can see the APV [http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 here]. | ||
We have two solutions for this: | We have two solutions for this: | ||
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!Link to safety APV and KBA | !Link to safety APV and KBA | ||
|[http://labmanager | |[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see APV here]. | ||
[http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | [http://kemibrug.dk/KBA/CAS/107388/?show_KBA=1&portaldesign=1 see KBA here] | ||
|[http://labmanager | |[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 see APV here] | ||
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Revision as of 11:47, 27 February 2017
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Wet etching of Chromium
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom B-1 or D-3. You can see the APV here.
We have two solutions for this:
- Commercial chromium etch (Chrome Etch 18). You can see the KBA here
- HNO3:H2O:cerisulphate - 90ml:1200ml:15g
Etch rate are depending on the level of oxidation of the metal.
How to mix the Chromium etch 2:
- Take a beaker and add 15g of cerisulphate.
- Add a little water while stirring - make sure all lumps are gone.
- Add water until 600 ml - keep stirring (use magnetic stirring)
- Add 90 ml HNO3
- When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.
Comparing the two wet chromium etches
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Link to safety APV and KBA | see APV here. | see APV here |
Chemical solution | Chrome Etch 18 | HNO3:H2O:cerisulphate - 90ml:1200ml:15g |
Process temperature | Room temperature | Room Temperature |
Possible masking materials | Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) |
Etch rate | ~ ? nm/min | ~40-100 nm/min |
Batch size | 1-7 4" wafers at a time | 1-7 4" wafers at a time |
Size of substrate | Any size and number that can go inside the beaker in use | Any size and number that can go inside the beaker in use |
Allowed materials | No restrictions.
Make a note on the beaker of which materials have been processed. |
No restrictions.
Make a note on the beaker of which materials have been processed. |