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Specific Process Knowledge/Thermal Process/C3 Anneal-bond furnace: Difference between revisions

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This furnace is the third furnace tube in the furnace C-stack positioned in cleanroom B-1.  
This furnace is the third furnace tube in the furnace C-stack positioned in cleanroom B-1.  


In this furnace it is allowed oxidize and anneal wafers without doing an RCA clean first. Also bonded wafers comming directly from the EVG NIL (assuming they were clean and not have been exposed to any metal when entering EVG NIL) can be processed in the furnace. Check the cross contamination information in LabManager before you use the furnace.
In this furnace it is allowed oxidize and anneal wafers without doing an RCA clean first. Also bonded wafers comming directly from the Wafer Bonder (assuming they were clean and not have been exposed to any metal when entering Wafer bonder) can be processed in the furnace. Check the cross contamination information in LabManager before you use the furnace.
Silicon wafers without any metal coming from PECVD 3 can be annealed in the furnace.


'''The user manual, technical information and contact information can be found in LabManager:'''
'''The user manual, technical information and contact information can be found in LabManager:'''
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