Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 84: | Line 84: | ||
|Allowed materials | |Allowed materials | ||
| | | | ||
*Silicon | *Silicon | ||
*Silicon Oxide | *Silicon Oxide | ||
*Silicon Nitride | *Silicon Nitride | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
| | | | ||
*Silicon | *Silicon | ||
*Silicon Oxide | *Silicon Oxide | ||
*Silicon Nitride | *Silicon Nitride | ||
*Silicon Oxynitride | *Silicon Oxynitride | ||
|- | |- | ||
|} | |} | ||