Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
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!colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample | !colspan="3" style="text-align:left;" | [[image:Create a film on your sample.png|x100px|Create a layer/film on your sample]] Create a layer/film on your sample | ||
|- | |- | ||
!Techniques | !Techniques | ||
!Materials | !Materials | ||
!Entry page in LabAdviser | |||
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|Thermal oxidation | |Thermal oxidation | ||
|Thermal SiO2 | |Thermal SiO2 | ||
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]] | |||
|[[Specific Process Knowledge/ | |||
|- | |- | ||
|Sputter deposition | |Sputter deposition | ||
|Si,SiO2,Si3N3,TiO2, metals | |Si,SiO2,Si3N3,TiO2, metals | ||
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | |||
|- | |- | ||
|Thermal evaporation | |Thermal evaporation | ||
|Al, ? | |Al, ? | ||
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|- | |- | ||
|E-beam evaporation | |E-beam evaporation | ||
|Metals | |Metals | ||
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|- | |- | ||
|LPCVD | |LPCVD | ||
|Si3N4, SRN, SiO2, Si (poly and amorph) | |Si3N4, SRN, SiO2, Si (poly and amorph) | ||
| | |||
|- | |- | ||
|PECVD | |PECVD | ||
|Si3N4, SiO2, PBSG | |Si3N4, SiO2, PBSG | ||
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|- | |- | ||
|Electroplating | |Electroplating | ||
|Ni | |Ni | ||
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|- | |- | ||
|Epitaxial growth /MOCVD | |Epitaxial growth /MOCVD | ||
|? | |? | ||
| | | | ||
|- | |- | ||
|Spin coating | |Spin coating | ||
|resists, polymers | |resists, polymers | ||
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]] | |||
|- | |- | ||
|Spray coating | |Spray coating | ||
|resists, polymers | |resists, polymers | ||
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]] | |||
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|} | |} |
Revision as of 13:22, 29 July 2014
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Overview of sample processing 4
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Overview of sample processing 5
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