Specific Process Knowledge/Lithography/mrEBL6000: Difference between revisions

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|[[media:Process_Flow_mrEBL6000.docx‎|Process_Flow_mrEBL6000.docx‎]]
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[[File:SpinCurveMrEBL6000.jpg|right|600px]]
The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. 9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.
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!colspan="7"|MicroResist mr EBL 6000 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 14-07-2014. Softbake 3 min @ 110 degC.
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Revision as of 12:47, 14 July 2014

Resist Polarity Manufacturer Comments Technical reports Spinner Developer Rinse Remover Process flows (in docx-format)
mr EBL 6000 Positive MicroResist Standard negative resist mrEBL6000 processing Guidelines.pdf‎ Manual Spinner 1 (Laurell), Spin Coater Labspin mr DEV IPA Process_Flow_mrEBL6000.docx‎


The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. 9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.


MicroResist mr EBL 6000 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 14-07-2014. Softbake 3 min @ 110 degC.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
2000 2000
3000 2000
4000 2000
5000 2000
6000 2000
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