Specific Process Knowledge/Thermal Process/Jipelec RTP: Difference between revisions

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==Jipelec - Rapid Thermal Processing==
[[Image:RTP_oven.jpg|300x300px|thumb|Jipelec RTP: Positioned in cleanroom 1]]
[[Image:RTP_oven.jpg|300x300px|thumb|Jipelec RTP: Positioned in cleanroom 1]]
The Jipelec is a rapid thermal processing oven. It should be used for fast and well-controlled annealing or alloying of samples. It is possible to use a pyrometer to control the temperature (of the carrier).
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter ranges
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
*0-1000 degree Celsius
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*atmosphere pressure
*vacuum
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
*Silicon
*Silicon oxides
*Silicon nitrides
*Quartz
*Polysilicon
*Titan
*III-V materials (on graphite carrier)
|-
|style="background:LightGrey; color:black"|Allowed materials on substrate
|style="background:WhiteSmoke; color:black"|
*
|-
|}

Revision as of 11:15, 26 October 2010

Jipelec - Rapid Thermal Processing

Jipelec RTP: Positioned in cleanroom 1

The Jipelec is a rapid thermal processing oven. It should be used for fast and well-controlled annealing or alloying of samples. It is possible to use a pyrometer to control the temperature (of the carrier).


Process parameter ranges Process Temperature
  • 0-1000 degree Celsius
Process pressure
  • atmosphere pressure
  • vacuum
Performance Substrate material allowed
  • Silicon
  • Silicon oxides
  • Silicon nitrides
  • Quartz
  • Polysilicon
  • Titan
  • III-V materials (on graphite carrier)
Allowed materials on substrate