Specific Process Knowledge/Thermal Process/Jipelec RTP: Difference between revisions
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==Jipelec - Rapid Thermal Processing== | |||
[[Image:RTP_oven.jpg|300x300px|thumb|Jipelec RTP: Positioned in cleanroom 1]] | [[Image:RTP_oven.jpg|300x300px|thumb|Jipelec RTP: Positioned in cleanroom 1]] | ||
The Jipelec is a rapid thermal processing oven. It should be used for fast and well-controlled annealing or alloying of samples. It is possible to use a pyrometer to control the temperature (of the carrier). | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter ranges | |||
|style="background:LightGrey; color:black"|Process Temperature | |||
|style="background:WhiteSmoke; color:black"| | |||
*0-1000 degree Celsius | |||
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|style="background:LightGrey; color:black"|Process pressure | |||
|style="background:WhiteSmoke; color:black"| | |||
*atmosphere pressure | |||
*vacuum | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | |||
| style="background:LightGrey; color:black"|Substrate material allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon | |||
*Silicon oxides | |||
*Silicon nitrides | |||
*Quartz | |||
*Polysilicon | |||
*Titan | |||
*III-V materials (on graphite carrier) | |||
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|style="background:LightGrey; color:black"|Allowed materials on substrate | |||
|style="background:WhiteSmoke; color:black"| | |||
* | |||
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Revision as of 11:15, 26 October 2010
Jipelec - Rapid Thermal Processing
The Jipelec is a rapid thermal processing oven. It should be used for fast and well-controlled annealing or alloying of samples. It is possible to use a pyrometer to control the temperature (of the carrier).
Process parameter ranges | Process Temperature |
|
---|---|---|
Process pressure |
| |
Performance | Substrate material allowed |
|
Allowed materials on substrate |
|