Specific Process Knowledge/Thin film deposition: Difference between revisions
| Line 12: | Line 12: | ||
*SU8 | *SU8 | ||
*Antistiction coating | *Antistiction coating | ||
*Topas | |||
*PMMA | |||
=== Other materials === | === Other materials === | ||
Revision as of 12:10, 11 October 2007
Choose material to deposit
Metals
- Aluminium
- Nickel
- Titanium
- Gold
Polymers
- SU8
- Antistiction coating
- Topas
- PMMA
Other materials
Choose deposition equipment
- Alcatel - E-beam evaporator and sputter tool
- Leybold - E-beam evaporator and multiple wafer tool
- Wordentec - Metal evaporator and ?
- Hummer - Gold sputtering system
- PECVD - Plasma Enhanced Chemical Vapor deposition
- B2 Furnace LPCVD Nitride - Deposition of silicon nitrid
- B3 Furnace LPCVD TEOS - Deposition of silicon oxide
- B4 Furnace LPCVD PolySilicon - Deposition of polysilicon
- MVD - Molecular Vapor Deposition