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| = Charging of non-conductive substrates and height measurements on transparent substrates= | | = Charging of non-conductive substrates= |
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| <span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography#top|Go to top of this page]]</span> | | <span style="font-size: 90%; text-align: right;">[[Specific_Process_Knowledge/Lithography/EBeamLithography#top|Go to top of this page]]</span> |
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| If you wish to investigate the charge dissipation using other methods than below, please contact [mailto:lithography@danchip.dtu.dk Lithography]. | | If you wish to investigate the charge dissipation using other methods than below, please contact [mailto:lithography@danchip.dtu.dk Lithography]. |
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| == Aluminum coating ==
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| At DTU Danchip, we recommend to use a thin (20 nm) layer of thermally evaporated [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|aluminum]] on top of the e-beam resist. Preferably, the thickness of Al and the e-beam dose should be optimised to the features you wish to e-beam pattern [http://nedds.co.uk/wp-content/uploads/2013/06/Greer-et-al-DRM-29-July-2012.pdf]. A good starting point is 20 nm Al; from here dose and development can be optimised to reach the resolution and feature size required.
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| The process flow for a standard e-beam exposure on ZEP520 with Al on top can be found here [[media:Process_Flow_ZEP_with_Al.docx|Process_Flow_ZEP_with_Al.docx]].
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| == ESPACER == | | == ESPACER == |
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| We have ESPACER in stock and approved for use in the cleanroom. You can find a guideline for a process flow here: [[media:Process_Flow_ZEP_ESPACER.docx|Process_Flow_ZEP_ESPACER.docx]]. Technical information of EPSCAER can be found here: [[media:Espacer_300_Technical_Info.pdf|Espacer_300_Technical_Info.pdf]], [[media:Espacer_catalog.pdf|Espacer_catalog.pdf]].
| | Espacer is a chemical that works as a discharging layer; it is spun onto the wafer on top of the resist and easily rinsed off the wafer after e-beam exposure. Visit this page for more information: [[Specific_Process_Knowledge/Lithography/Espacer|Espacer]] |
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| Please contact [mailto:lithography@danchip.dtu.dk Lithography] if you wish to test this material.
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| | == Aluminum coating == |
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| {|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" style="width: 60%;"
| | At DTU Danchip, we recommend to use a thin (20 nm) layer of thermally evaporated [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|aluminum]] on top of the e-beam resist. Preferably, the thickness of Al and the e-beam dose should be optimised to the features you wish to e-beam pattern [http://nedds.co.uk/wp-content/uploads/2013/06/Greer-et-al-DRM-29-July-2012.pdf]. A good starting point is 20 nm Al; from here dose and development can be optimised to reach the resolution and feature size required. |
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| | The process flow for a standard e-beam exposure on ZEP520 with Al on top can be found here [[media:Process_Flow_ZEP_with_Al.docx|Process_Flow_ZEP_with_Al.docx]]. |
| |-style="background:Black; text-align:center; color:White"
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| !Process
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| !No ESPACER
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| !ESPACER
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |Resist
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| |colspan="2"| AR-P 6200/2 AllResist E-beam resist
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |Spin Coat
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| |colspan="2"|1 min @ 4000 rpm, softbake 2 min @ 150 degC, thickness ~140nm
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |ESPACER
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| |1 min @ 2000 rpm (no softbake)
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |E-beam exposure
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| |colspan="2"|2 nA, aperture 5, dose 150-310 muC/cm2, SHOT A,10
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |Developing
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| |colspan="2"|SX-AR 600-54/6 60 sec, 60 sec IPA rinse
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |Characterization
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| |colspan="2"|Nikon ECLIPSE optical microscope, E-5
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |[[File:NoESPACERoverview2.png|300px]]
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| |[[File:ESPACERoverview.png|300px]]
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| |-
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |[[File:NoESPACERbasedose.png|300px]]
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| |[[File:ESPACERbasedose.png|300px]]
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| |-
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| |-style="background:WhiteSmoke; text-align:center; color:black"
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| |[[File:noESPACERbasedose+5%.png|300px]]
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| |}
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