Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
| Line 40: | Line 40: | ||
|Possible masking materials: | |Possible masking materials: | ||
|Stoichiometric Si<math>_3</math>N<math>_4</math> | |Stoichiometric Si<math>_3</math>N<math>_4</math> | ||
Si-rich Si<math>_3</math>N<math>_4</math> | |||
| | | | ||
Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||