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| ===The section below here is under construction [[Image:section under construction.jpg|70px]] === | | ===The section below here is under construction [[Image:section under construction.jpg|70px]] === |
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| ==Overview of sample processing 2==
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| {| {{Table}}
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| |- valign="top"
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! [[image:cleaning.jpg|thumb|150px|Clean the sample]]
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! [[image:drying.jpg|thumb|150px|Drying Samples ]]
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! [[image:Making a layer 1.jpg|thumb|140px|Film Formation ]]
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| |-
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| |Thermal Oxide growth
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| |-
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| |Thin Film deposition
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| |-
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| |Sputter deposition
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| |-
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| |Thermal deposition
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| |-
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| |E-beam evaporation
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| |-
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| |CVD
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| |-
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| |LPCVD
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| |-
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| |PECVD
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| |-
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| |Coating
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| |-
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| |Spin coating
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| |-
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| |Spray coating
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| |-
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| |Electroplating
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| |-
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| |Epitaxial growth
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| |-
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! [[image:Thermal treatment 1.jpg|thumb|150px|Thermal treatment of the sample ]]
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| |}
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| |-
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! [[image:Making a mask 1.jpg|thumb|140px|Make a mask on the sample ]]
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| |-
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| |Lithography
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| |-
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| |Imprinting
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| |-
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Transfer pattern into the sample
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| |-
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| |Wet etch
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| |-
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| |Dry etch
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| |-
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| |Lift-off
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| |-
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Direct structure definition
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| |-
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| |Imprinting
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| |-
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| |LASER machining
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| |-
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| |Lithographic definition
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| |-
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| |Polymer Injection molding
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| |-
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| |}
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Bonding samples together
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| |}
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| |-
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| {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Characterize the sample
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| |}
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| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left"
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| ! Back end of the sample
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| |-
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| |Chip/die mounting
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| |-
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| |Wire bonding
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| |-
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| |Dicing
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| |-
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| |}
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| |-
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| |}
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| ==Overview of sample processing 3== | | ==Overview of sample processing 3== |
2nd Level - Process Topic
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction
Overview of sample processing 3
Clean your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer cleaning
|
Soap Sonic
|
Removes dust and particles
|
|
7-up & Piranha
|
Removes organics and alkali ions
|
|
RCA
|
Two step process to remove organics and metals
|
|
5% HF
|
Removes native oxide
|
|
IMEC
|
Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|
|
Dry your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer and sample drying
|
Spin dryers
|
Whole wafers
|
|
Critial point dryer
|
Sensitive wafers
|
|
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process/Oxidation
|
Thermal oxidation
|
Thermal SiO2
|
Thin film deposition
|
|
|
|
Sputter deposition
|
Si,SiO2,Si3N3,TiO2, metals
|
|
Thermal evaporation
|
Al, ?
|
|
E-beam evaporation
|
Metals
|
|
LPCVD
|
Si3N4, SRN, SiO2, Si (poly and amorph)
|
|
PECVD
|
Si3N4, SiO2, PBSG
|
|
Electroplating
|
Ni
|
Lithography/Coaters
|
|
|
|
Spin coating
|
resists, polymers
|
|
Spray coating
|
resists, polymers
|
Epitaxial growth
|
MOCVD
|
?
|
|
|
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process
|
Annealing
|
Si, PECVD layers
|
|
Oxidation
|
Si wafers
|
|
Doping with B/P
|
Si wafers
|
|
Pyrolysis
|
Resists?
|
|
|
Entry page in LabAdviser
|
Techniques
|
Lithography
|
|
|
Photolithography
|
|
Deep UV lithography
|
|
E-beam lithography
|
|
Imprinting
|
|
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Etch
|
|
|
|
Wet etch
|
Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
|
|
Dry etch
|
Any material
|
Lift-off
|
|
?
|
|
|
Imprinting
|
LASER machining
|
Lithographic definition
|
Polymer Injection molding
|
|
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Chip/die mounting
|
Wire bonding
|
Dicing
|
|
|
Overview of sample processing 4
Clean your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer cleaning
|
Soap Sonic
|
Removes dust and particles
|
|
7-up & Piranha
|
Removes organics and alkali ions
|
|
RCA
|
Two step process to remove organics and metals
|
|
5% HF
|
Removes native oxide
|
|
IMEC
|
Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|
|
Dry your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer and sample drying
|
Spin dryers
|
Whole wafers
|
|
Critial point dryer
|
Sensitive wafers
|
|
Create a layer/film on your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process/Oxidation
|
Thermal oxidation
|
Thermal SiO2
|
Thin film deposition
|
|
|
|
Sputter deposition
|
Si,SiO2,Si3N3,TiO2, metals
|
|
Thermal evaporation
|
Al, ?
|
|
E-beam evaporation
|
Metals
|
|
LPCVD
|
Si3N4, SRN, SiO2, Si (poly and amorph)
|
|
PECVD
|
Si3N4, SiO2, PBSG
|
|
Electroplating
|
Ni
|
Lithography/Coaters
|
|
|
|
Spin coating
|
resists, polymers
|
|
Spray coating
|
resists, polymers
|
Epitaxial growth
|
MOCVD
|
?
|
|
|
Thermal treatment of your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process
|
Annealing
|
Si, PECVD layers
|
|
Oxidation
|
Si wafers
|
|
Doping with B/P
|
Si wafers
|
|
Pyrolysis
|
Resists?
|
|
Make a mask on your sample
|
Entry page in LabAdviser
|
Techniques
|
Lithography
|
|
|
Photolithography
|
|
Deep UV lithography
|
|
E-beam lithography
|
|
Imprinting
|
|
Transfer mask pattern to your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Etch
|
|
|
|
Wet etch
|
Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
|
|
Dry etch
|
Any material
|
Lift-off
|
|
?
|
|
Define your structure directly
|
Imprinting
|
LASER machining
|
Lithographic definition
|
Polymer Injection molding
|
|
Bond your samples together
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Characterize your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Pack your sample (back-end)
|
Chip/die mounting
|
Wire bonding
|
Dicing
|
|
|
jmli test