Specific Process Knowledge: Difference between revisions

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===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
==Overview of sample processing 2==
{| {{Table}}
|- valign="top"
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:cleaning.jpg|thumb|150px|Clean the sample]]
|}
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:drying.jpg|thumb|150px|Drying Samples ]]
|}
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Making a layer 1.jpg|thumb|140px|Film Formation ]]
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|Thermal Oxide growth
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|Thin Film deposition
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|-
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|Sputter deposition
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|Thermal deposition
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|E-beam evaporation
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|CVD
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|-
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|LPCVD
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|PECVD
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|Coating
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|-
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|Spin coating
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|Spray coating
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|Electroplating
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|Epitaxial growth
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|-
|}
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Thermal treatment 1.jpg|thumb|150px|Thermal treatment of the sample ]]
|}
|-
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Making a mask 1.jpg|thumb|140px|Make a mask on the sample ]]
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|Lithography
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|Imprinting
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|}
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Transfer pattern into the sample
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|Wet etch
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|Dry etch
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|Lift-off
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|}
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Direct structure definition
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|Imprinting
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|LASER machining
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|Lithographic definition
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|Polymer Injection molding
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|}
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Bonding samples together
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|-
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Characterize the sample
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Back end of the sample
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|Chip/die mounting
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|Wire bonding
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|Dicing
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|}
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|-
|}


==Overview of sample processing 3==
==Overview of sample processing 3==

Revision as of 14:35, 15 July 2014

2nd Level - Process Topic

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Overview of sample processing 3

Bond your samples together
Entry page in LabAdviser Techniques Materials
Characterize your sample
Entry page in LabAdviser Techniques Materials

Overview of sample processing 4


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