Specific Process Knowledge: Difference between revisions
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==Overview of sample processing 4== | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Clean your sample.png|100px|Clean your sample]] <br/> Clean your sample | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]] | |||
|Soap Sonic | |||
|Removes dust and particles | |||
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|7-up & Piranha | |||
|Removes organics and alkali ions | |||
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|RCA | |||
|Two step process to remove organics and metals | |||
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|5% HF | |||
|Removes native oxide | |||
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|IMEC | |||
|Removing dust, organics and alkali ions and slightly polish the surface. | |||
Make the surface hydrophillic | |||
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{| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2" align="right" | |||
! [[image:Dry your sample.png|thumb|100px|Dry your sample]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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|[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]] | |||
|Spin dryers | |||
|Whole wafers | |||
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|Critial point dryer | |||
|Sensitive wafers | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Create a film on your sample.png|thumb|100px|Create a layer/film on your sample]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]] | |||
|Thermal oxidation | |||
|Thermal SiO2 | |||
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|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | |||
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|Sputter deposition | |||
|Si,SiO2,Si3N3,TiO2, metals | |||
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|Thermal evaporation | |||
|Al, ? | |||
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|E-beam evaporation | |||
|Metals | |||
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|LPCVD | |||
|Si3N4, SRN, SiO2, Si (poly and amorph) | |||
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|PECVD | |||
|Si3N4, SiO2, PBSG | |||
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|Electroplating | |||
|Ni | |||
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|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]] | |||
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|Spin coating | |||
|resists, polymers | |||
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|Spray coating | |||
|resists, polymers | |||
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|Epitaxial growth | |||
|MOCVD | |||
|? | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Dope your sample.png|thumb|100px|Dope your sample]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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|[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]] | |||
|PECVD | |||
|Deposition of SiO2 or Si3N4 doped with P,B and Ge | |||
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|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]] | |||
|LPCVD | |||
|Deposition of PolySi doped with B or P | |||
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|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]] | |||
|Predeposition and drive-in | |||
|Doping Silicon wafers with boron | |||
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|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]] | |||
|Predeposition and drive-in | |||
|Doping Silicon wafers with phosphorus | |||
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|[[Specific Process Knowledge/Doping|Doping]] | |||
|Ion implant | |||
|? | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Thermal treat your sample.png|thumb|100px|Thermal treatment of your sample]] | |||
|- | |||
!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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|[[Specific Process Knowledge/Thermal Process|Thermal Process]] | |||
|Annealing | |||
|Si, PECVD layers | |||
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|Oxidation | |||
|Si wafers | |||
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|Doping with B/P | |||
|Si wafers | |||
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|Pyrolysis | |||
|Resists? | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Make a mask on your sample.png|thumb|100px|Make a mask on your sample]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
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|[[Specific Process Knowledge/Lithography| Lithography]] | |||
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|Photolithography | |||
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|Deep UV lithography | |||
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|E-beam lithography | |||
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|Imprinting | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Transfer mask pattern to your sample]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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|[[Specific Process Knowledge/Etch| Etch]] | |||
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|Wet etch | |||
|Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs | |||
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|Dry etch | |||
|Any material | |||
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|[[Specific Process Knowledge/Lithography/LiftOff| Lift-off]] | |||
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|? | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Define your structure directly to your sample]] | |||
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|Imprinting | |||
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|LASER machining | |||
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|Lithographic definition | |||
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|Polymer Injection molding | |||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Bond your samples together.png|thumb|100px|Bond your samples together]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Characterize your sample.png|thumb|100px|Characterize your sample]] | |||
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!Entry page in LabAdviser | |||
!Techniques | |||
!Materials | |||
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | |||
! [[image:Pack your sample (back-end).png|thumb|100px|Pack your sample (back-end)]] | |||
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|Chip/die mounting | |||
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|Wire bonding | |||
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|Dicing | |||
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[[/temp| jmli test ]] | [[/temp| jmli test ]] |
Revision as of 12:13, 1 July 2014
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Overview of sample processing 2
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Overview of sample processing 3
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Overview of sample processing 4
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