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==Overview of sample processing 4==
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Clean your sample.png|100px|Clean your sample]] <br/> Clean your sample
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!Entry page in LabAdviser
!Techniques
!Materials
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|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
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|7-up & Piranha
|Removes organics and alkali ions
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|RCA
|Two step process to remove organics and metals
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|5% HF
|Removes native oxide
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|IMEC
|Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
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{| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2"  align="right"
! [[image:Dry your sample.png|thumb|100px|Dry your sample]]
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!Entry page in LabAdviser
!Techniques
!Materials
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|[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|Spin dryers
|Whole wafers
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|Critial point dryer
|Sensitive wafers
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Create a film on your sample.png|thumb|100px|Create a layer/film on your sample]]
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!Entry page in LabAdviser
!Techniques
!Materials
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|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|Thermal oxidation
|Thermal SiO2
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|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
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|Sputter deposition
|Si,SiO2,Si3N3,TiO2, metals
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|Thermal evaporation
|Al, ?
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|E-beam evaporation
|Metals
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|LPCVD
|Si3N4, SRN, SiO2, Si (poly and amorph)
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|PECVD
|Si3N4, SiO2, PBSG
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|Electroplating
|Ni
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|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
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|Spin coating
|resists, polymers
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|Spray coating
|resists, polymers
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|Epitaxial growth
|MOCVD
|?
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Dope your sample.png|thumb|100px|Dope your sample]]
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!Entry page in LabAdviser
!Techniques
!Materials
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|[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
|PECVD
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
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|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
|LPCVD
|Deposition of PolySi doped with B or P
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|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
|Predeposition and drive-in
|Doping Silicon wafers with boron
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|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
|Predeposition and drive-in
|Doping Silicon wafers with phosphorus
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|[[Specific Process Knowledge/Doping|Doping]]
|Ion implant
|?
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Thermal treat your sample.png|thumb|100px|Thermal treatment of your sample]]
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!Entry page in LabAdviser
!Techniques
!Materials
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|[[Specific Process Knowledge/Thermal Process|Thermal Process]]
|Annealing
|Si, PECVD layers
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|Oxidation
|Si wafers
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|Doping with B/P
|Si wafers
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|Pyrolysis
|Resists?
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Make a mask on your sample.png|thumb|100px|Make a mask on your sample]]
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!Entry page in LabAdviser
!Techniques
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|[[Specific Process Knowledge/Lithography| Lithography]]
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|Photolithography
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|Deep UV lithography
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|E-beam lithography
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|Imprinting
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Transfer mask pattern to your sample]]
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!Entry page in LabAdviser
!Techniques
!Materials
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|[[Specific Process Knowledge/Etch| Etch]]
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|Wet etch
|Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
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|Dry etch
|Any material
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|[[Specific Process Knowledge/Lithography/LiftOff| Lift-off]]
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|?
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Define your structure directly to your sample]]
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|Imprinting
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|LASER machining
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|Lithographic definition
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|Polymer Injection molding
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Bond your samples together.png|thumb|100px|Bond your samples together]]
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!Entry page in LabAdviser
!Techniques
!Materials
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{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Characterize your sample.png|thumb|100px|Characterize your sample]]
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!Entry page in LabAdviser
!Techniques
!Materials
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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Pack your sample (back-end).png|thumb|100px|Pack your sample (back-end)]]
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|Chip/die mounting
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|Wire bonding
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|Dicing
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[[/temp| jmli test ]]
[[/temp| jmli test ]]

Revision as of 12:13, 1 July 2014

2nd Level - Process Topic

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Overview of sample processing 2

Clean the sample
Drying Samples
Thermal treatment of the sample
Bonding samples together
Characterize the sample

Overview of sample processing 3

Bond your samples together
Entry page in LabAdviser Techniques Materials
Characterize your sample
Entry page in LabAdviser Techniques Materials

Overview of sample processing 4

Bond your samples together
Entry page in LabAdviser Techniques Materials
Characterize your sample
Entry page in LabAdviser Techniques Materials


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