Specific Process Knowledge/Wafer and sample drying: Difference between revisions

From LabAdviser
Bghe (talk | contribs)
No edit summary
Bghe (talk | contribs)
Line 53: Line 53:
*<nowiki>#</nowiki> 150 mm wafers  
*<nowiki>#</nowiki> 150 mm wafers  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*One 100mm wafer
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
* Pieces (up to 10x10mm)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
Line 65: Line 66:
*No restrictions
*No restrictions
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
?
*Si,SiO2, Si3N4
*Quartz and Pyrex
*InAlP, GaAs
*SU8
|-  
|-  
|}
|}
Line 76: Line 80:


=== Spin dryers ===
=== Spin dryers ===
=Spin Dryers=
=Spin Dryers=



Revision as of 07:31, 1 July 2014

Feedback to this page: click here

Drying Comparison Table

Equipment Spin dryer 1 Spin dryer 2 Spin dryer 3 Spin dryer 4 Critical point dryer
Location
  • C-1
  • B-1
  • D-4
  • E-5
  • D-4
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
  • Drying sensitive samples. E.g. with cantilevers
Substrates Batch size
  • # 100 mm wafers
  • # 100 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • 1 to 5 wafers per run. Sizes: 2”, 4" or 6"
  • Pieces (up to 10x10mm)
Allowed materials
  • No restrictions
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions
  • Si,SiO2, Si3N4
  • Quartz and Pyrex
  • InAlP, GaAs
  • SU8


Choose a drying equipment

Spin dryers

Spin Dryers

Image(s) of the equipment(s)


A tool used for drying wafers. A single cassette of wafers is placed in a stainless steel rotor. The wafers are centered just off the axis of rotation, and rotated at high RPM so that centrifugal force “locks” the wafers in place.

Some of the tools have DI water connected, and can be used for both rinsing and drying of wafers, while other tools do not and can only be used for drying. All wafers have to be washed in a wetbench cleaning station before going into the spin dryer, regardless of using the rinse function or not.


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager: LabManager


Process information

Standard process is 120 seconds for 100mm wafers or 180 seconds for 150mm wafers, at 2000 RPM - drying only.

If rinsing is used as well, the standard process is 60 seconds of rinse at 500 RPM, followed by 120/180 seconds of drying at 2000 RPM.



Spin Dryer Comparison Table

Equipment Spin dryer 1 Spin dryer 2 Spin dryer 3 Spin dryer 4
Location
  • CR3
  • CR2
  • CR4
  • CR13
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
Substrates Batch size
  • # 100 mm wafers
  • # 100 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • No restrictions
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions