Specific Process Knowledge: Difference between revisions
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==Overview of sample processing 3== | ==Overview of sample processing 3== | ||
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! [[image:Clean your sample.png|thumb|150px|Clean your sample]] | ! [[image:Clean your sample.png|thumb|150px|Clean your sample]] | ||
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|[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]] | |[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]] | ||
|Soap Sonic | |Soap Sonic | ||
| | |Removes dust and particles | ||
|- | |- | ||
| | | | ||
|7-up & Piranha | |7-up & Piranha | ||
| | |Removes organics and alkali ions | ||
|- | |- | ||
| | | | ||
|RCA | |RCA | ||
| | |Two step process to remove organics and metals | ||
|- | |- | ||
| | | | ||
|5% HF | |5% HF | ||
| | |Removes native oxide | ||
|- | |- | ||
| | | | ||
|IMEC | |IMEC | ||
| | |Removing dust, organics and alkali ions and slightly polish the surface. | ||
Make the surface hydrophillic | |||
|- | |- | ||
|} | |} |
Revision as of 07:19, 1 July 2014
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Overview of sample processing
Clean the sample |
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Drying Samples |
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Thermal treatment of the sample |
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Make a mask on the sample |
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Lithography |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |
Overview of sample processing 2
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Overview of sample processing 3
Entry page in LabAdviser | Techniques | Materials |
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Specific Process Knowledge/Wafer cleaning | Soap Sonic | Removes dust and particles |
7-up & Piranha | Removes organics and alkali ions | |
RCA | Two step process to remove organics and metals | |
5% HF | Removes native oxide | |
IMEC | Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic |
Entry page in LabAdviser | Techniques | Materials |
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Entry page in LabAdviser | Techniques | Materials |
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Thermal Process/Oxidation | Thermal oxidation | Thermal SiO2 |
Thin film deposition | ||
Sputter deposition | Si,SiO2,Si3N3,TiO2, metals | |
Thermal evaporation | Al, ? | |
E-beam evaporation | Metals | |
LPCVD | Si3N4, SRN, SiO2, Si (poly and amorph) | |
PECVD | Si3N4, SiO2, PBSG | |
Electroplating | Ni | |
Lithography/Coaters | ||
Spin coating | resists, polymers | |
Spray coating | resists, polymers | |
Epitaxial growth | MOCVD | ? |
Entry page in LabAdviser | Techniques | Materials |
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Thin film deposition/PECVD | PECVD | Deposition of SiO2 or Si3N4 doped with P,B and Ge |
Thin film deposition/Furnace LPCVD PolySilicon | LPCVD | Deposition of PolySi doped with B or P |
Thermal Process/Dope with Boron | Predeposition and drive-in | Doping Silicon wafers with boron |
Thermal Process/Dope with Phosphorus | Predeposition and drive-in | Doping Silicon wafers with phosphorus |
Ionimplant | ? |
Entry page in LabAdviser | Techniques | Materials |
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Entry page in LabAdviser | Techniques |
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Lithography | |
Photolithography | |
Deep UV lithography | |
E-beam lithography | |
Imprinting |
Entry page in LabAdviser | Techniques | Materials |
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Etch | ||
Wet etch | Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs | |
Dry etch | Any material | |
Lift-off | ? |
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Entry page in LabAdviser | Techniques | Materials |
---|---|---|
Entry page in LabAdviser | Techniques | Materials |
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Chip/die mounting |
Wire bonding |
Dicing |