Specific Process Knowledge: Difference between revisions
Appearance
| Line 262: | Line 262: | ||
!Techniques | !Techniques | ||
!Materials | !Materials | ||
|- | |||
|[[Specific Process Knowledge/Wafer cleaning|Specific Process Knowledge/Wafer cleaning]] | |||
|Soap Sonic | |||
|Removing dust and particles | |||
|- | |- | ||
| | | | ||
| | |7-up & Piranha | ||
| | | | ||
|- | |- | ||
| | | | ||
| | |RCA | ||
| | | | ||
|- | |- | ||
| | | | ||
| | |5% HF | ||
| | | | ||
|- | |- | ||
| | | | ||
| | |IMEC | ||
| | | | ||
|- | |- | ||