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Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions

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| 20 µm
| 20 µm
| [[media:TB_1064nm_255mm_cutting_Pyrex_525um.xls|Cutting Pyrex 525µm parameters]]
| [[media:TB_1064nm_255mm_cutting_Pyrex_525um.xls|Cutting Pyrex 525µm parameters]]
| Cutting through. Dicing circle.  
| Cutting through. Dicing circle. Can probably be optimized: 3 lines may be enough and half the iterations (tried by Azeem)
|-
|-
|- style="background:LightGray;text-align:center" valign="top"
|- style="background:LightGray;text-align:center" valign="top"
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