Specific Process Knowledge/Etch/III-V RIE/III V RIE ETCHES: Difference between revisions
Created page with "==CHF3/O2 etch== A plasma with a gas mixture of CHF<sub>3</sub> and O<sub>2</sub> is used to etch SiO<sub>2</sub> and Si<sub>3</sub>Ni<sub>4</sub> dielectricas; flour radical..." |
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==CHF3/O2 etch== | ==CHF3/O2 etch== | ||