Specific Process Knowledge/Lithography/ZEP520A: Difference between revisions

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1 The disposable pipettes are not cleanroom compatible and must therefore be handled with care inside the cleanroom. Each bag contain 10 pipettes; this bags must be opened inside a fumehood and each pipette must be cleaned with a N<sub>2</sub> gun before use.
1 The disposable pipettes are not cleanroom compatible and must therefore be handled with care inside the cleanroom. Each bag contain 10 pipettes; the bags must be opened inside a fumehood and each pipette must be cleaned with a N<sub>2</sub> gun before use.


2 The e-beam writer measures the height of the substrate and adjust the focus accordingly. This requires no actual chip marks on the wafer. See e-beam writer manual.
2 The e-beam writer measures the height of the substrate and adjust the focus accordingly. This requires no actual chip marks on the wafer. See e-beam writer manual.

Revision as of 08:38, 16 June 2014

These tests are currently in progress and this page thus under construction. If you have questions to the process or wish to use this e-beam resist, please contact Tine Greibe at tigre@danchip.dtu.dk.


Process Flow

Test of ZEP resist; a positive e-beam resist from ZEON.


Equipment Process Parameters Comments Initials and date
Pretreatment
4" Si wafers No Pretreatment TIGRE, 23-04-2014
Spin Coat
Spin Coater Manual, LabSpin, A-5 ZEP520A 1:1 or ZEP520A 1:2 E-beam resist

60 sec at various spin speed. Acceleration 4000 s-2, softbake 2 min at 180 deg Celcius

Resist poured directly from bottle or by use of disposable pipette1 TIGRE, 23-04-2014, 21-05-2014
Characterization
Ellipsometer VASE B-1 9 points measured on 100 mm wafer ZEP program used; measured at 70 deg only TIGRE, 23-04-2014, 21-05-2014
E-beam Exposure
JEOL 9500 E-beam writer, E-1 Dosepattern 14nm - 100nm,

dose 120-280 muC/cm2

Virtual chip mark height detection2 TIGRE
Development
Fumehood, D-3 60 sec in N50,

60 sec rinse in IPA, N2 Blow dry

Agitation (by hand) while developing TIGRE, XX-04-2014
Characterization
Zeiss SEM Supra 60VP, D-3 TIGRE, ??-04-2014

1 The disposable pipettes are not cleanroom compatible and must therefore be handled with care inside the cleanroom. Each bag contain 10 pipettes; the bags must be opened inside a fumehood and each pipette must be cleaned with a N2 gun before use.

2 The e-beam writer measures the height of the substrate and adjust the focus accordingly. This requires no actual chip marks on the wafer. See e-beam writer manual.

Spin Curves


The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on a Si wafer with native oxide. The measurements are performed at one incidence angle (70 degrees) only. 9 points on each 4" wafer has been measured; the standard deviation thus represents the homogeinity of the film on the 4" wafers.

ZEON ZEP520A1:1 in anisole spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 23-04-2014. Resist was mixed 13-01-2014, i.e. approximatley 3 months old.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
3000 4000 111.29 0.65
4000 4000 95.17 2.16
5000 4000 87.23 0.81


ZEON ZEP520A1:1 in anisole spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 21-05-2014. Resist was mixed 15-05-2014, i.e. approximatley 6 days old.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
2000 4000 141.03 1.02
3000 4000 115.96 0.98
4000 4000 100.56 0.80
5000 4000 91.01 0.38
6000 4000 84.85 0.37


ZEON ZEP520A1:2 in anisole spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 21-05-2014. Resist was mixed 15-05-2014, i.e. approximatley 6 days old.
Spin Speed [rpm] Acceleration [1/s2] Thickness [nm] St Dev
2000 4000 79.12 1.74
3000 4000 64.30 0.34
4000 4000 55.50 0.48
5000 4000 50.53 0.62
6000 4000 46.34 1.01