Specific Process Knowledge: Difference between revisions

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2nd Level - Process Topic

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Back-end processing

Characterization

E-beam lithography

Etch

Imprinting

Lithography

Thermal Process

Thin film deposition

Wafer and sample drying

Wafer Bonding

Wafer Cleaning

Wafer Information

III-V Process

The section below here is under construction

Overview of sample processing

Clean the sample

Drying Samples

Make a layer on the sample or Film Formation
Thermal Oxide growth
Physical Vapour Deposition
	Sputter deposition
	Thermal deposition
	E-beam evaporation
CVD
	LPCVD
	PECVD
Coating
	Spin coating
	Spray coating
Electroplating
Epitaxial growth

Thermal treatment of the sample

Make a mask on the sample
Lithography
Imprinting

Transfer pattern into the sample
Wet etch
Dry etch
Lift-off

Direct structure definition
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bonding samples together

Characterize the sample

Back end of the sample
Chip/die mounting
Wire bonding
Dicing

Overview of sample processing 2

Clean the sample

Drying Samples

Film Formation
Thermal Oxide growth
Thin Film deposition
	Sputter deposition
	Thermal deposition
	E-beam evaporation
CVD
	LPCVD
	PECVD
Coating
	Spin coating
	Spray coating
Electroplating
Epitaxial growth

Thermal treatment of the sample

Make a mask on the sample
Lithography
Imprinting

Transfer pattern into the sample
Wet etch
Dry etch
Lift-off

Direct structure definition
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bonding samples together

Characterize the sample

Back end of the sample
Chip/die mounting
Wire bonding
Dicing

Overview of sample processing 3

Clean your sample

Drying your Samples

Create a layer/film on your sample
Thermal Oxide growth
Physical Vapour Deposition
	Sputter deposition
	Thermal deposition
	E-beam evaporation
CVD
	LPCVD
	PECVD
Coating
	Spin coating
	Spray coating
Electroplating
Epitaxial growth

Thermal treatment of your sample

Make a mask on your sample
Lithography
Imprinting

Transfer pattern to your sample
Wet etch
Dry etch
Lift-off

Direct structure definition on your sample
Imprinting
LASER machining
Lithographic definition
Polymer Injection molding

Bonding samples together

Characterize the sample

Back end processing of your sample
Chip/die mounting
Wire bonding
Dicing

@@ Line 259: / Line 259: @@
 ==Overview of sample processing 3==
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Clean the sample
+! Clean your sample
 |}
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Drying Samples
+! Drying your Samples
 |}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Make a layer on the sample or Film Formation
+! Create a layer/film on your sample
 |-
 |Thermal Oxide growth
@@ Line 310: / Line 310: @@
 {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Thermal treatment of the sample
+! Thermal treatment of your sample
 |}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Make a mask on the sample
+! Make a mask on your sample
 |-
 |Lithography
@@ Line 321: / Line 321: @@
 |}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Transfer pattern into the sample
+! Transfer pattern to your sample
 |-
 |Wet etch
@@ Line 331: / Line 331: @@
 |}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Direct structure definition
+! Direct structure definition on your sample
 |-
 |Imprinting
@@ Line 349: / Line 349: @@
 |}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Back end of the sample
+! Back end processing of your sample
 |-
 |Chip/die mounting