Specific Process Knowledge: Difference between revisions
| Line 259: | Line 259: | ||
==Overview of sample processing 3== | ==Overview of sample processing 3== | ||
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Clean the sample |} | ! Clean the sample | ||
|} | |||
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Drying Samples |} | ! Drying Samples | ||
|} | |||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
Revision as of 13:27, 12 June 2014
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction 
Overview of sample processing
Clean the sample 
|
|---|
Drying Samples 
|
|---|
Make a layer on the sample or Film Formation 
| |
|---|---|
| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
Thermal treatment of the sample 
|
|---|
Make a mask on the sample 
|
|---|
| Lithography |
| Imprinting |
| Transfer pattern into the sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
|---|
| Characterize the sample |
|---|
| Back end of the sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |
Overview of sample processing 2
|
|
|
| ||||||||||||||||||||||||||||||
|
|
|
| ||||||||||||||||||||||||||||||
|
|
Overview of sample processing 3
| Clean the sample |
|---|
| Drying Samples |
|---|
| Make a layer on the sample or Film Formation | |
|---|---|
| Thermal Oxide growth | |
| Physical Vapour Deposition | |
| Sputter deposition | |
| Thermal deposition | |
| E-beam evaporation | |
| CVD | |
| LPCVD | |
| PECVD | |
| Coating | |
| Spin coating | |
| Spray coating | |
| Electroplating | |
| Epitaxial growth |
| Thermal treatment of the sample |
|---|
| Make a mask on the sample |
|---|
| Lithography |
| Imprinting |
| Transfer pattern into the sample |
|---|
| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
|---|
| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
|---|
| Characterize the sample |
|---|
| Back end of the sample |
|---|
| Chip/die mounting |
| Wire bonding |
| Dicing |