Specific Process Knowledge: Difference between revisions

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===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
==Overview of sample processing==
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Clean the sample [[File:cleaning.jpg|50px]]
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Drying Samples [[File:drying.jpg|50px]]
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Make a layer on the sample or Film Formation [[File:Making a layer 1.jpg|40px]]
|-
|Thermal Oxide growth
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|-
|Thin Film deposition
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|-
|
|Sputter deposition
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|
|Thermal deposition
|-
|
|E-beam evaporation
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|CVD
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|-
|
|LPCVD
|-
|
|PECVD
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|Coating
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|-
|
|Spin coating
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|Spray coating
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|Electroplating
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|-
|Epitaxial growth
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|-
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Thermal treatment of the sample [[File:Thermal treatment 1.jpg|50px]]
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Make a mask on the sample [[File:Making a mask 1.jpg|40px]]
|-
|Lithography
|-
|Imprinting
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Transfer pattern into the sample
|-
|Wet etch
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|Dry etch
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|Lift-off
|-
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Direct structure definition
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|Imprinting
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|LASER machining
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|Lithographic definition
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|Polymer Injection molding
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|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Bonding samples together
|}
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! Characterize the sample
|}
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! Back end of the sample
|-
|Chip/die mounting
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|Wire bonding
|-
|Dicing
|-
|}


==Overview of sample processing==
==Overview of sample processing==

Revision as of 08:11, 12 June 2014

2nd Level - Process Topic

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Choose the process topic you are interested in

The section below here is under construction

Overview of sample processing

Clean the sample
Drying Samples
Thermal treatment of the sample
Bonding samples together
Characterize the sample


Overview of sample processing

Clean the sample
Drying Samples
Thermal treatment of the sample
Bonding samples together
Characterize the sample
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