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Specific Process Knowledge/Lithography: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,531 edits
Line 44: Line 44:
*~20nm and up
*~20nm and up
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*3D: 0.3 µm spot; 1.3 µm high
*3D voxel through transparent substrate: 0.3 µm diameter; 0.6 µm high
*2D spot on opaque substrate: 0.6 µm diameter
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Line 67: Line 68:
**PMMA
**PMMA
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*UV cross-linking:
*UV sensitive:
**IP photoresists
**IP photoresists, SU-8 (3D)
**SU-8
**AZ resists (2D)
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Line 83: Line 84:
~ 100nm to 2µm
~ 100nm to 2µm
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droplet
droplet or coating
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