Specific Process Knowledge: Difference between revisions
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!Transfer pattern into the sample | ! Transfer pattern into the sample | ||
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|Wet etch | |Wet etch | ||
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!Direct structure definition | ! Direct structure definition | ||
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|Imprinting | |Imprinting | ||
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!Back end of the sample | ! Back end of the sample | ||
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|Chip/die mounting | |Chip/die mounting |
Revision as of 15:58, 27 May 2014
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Overview of sample processing
Clean the sample |
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Drying Samples |
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Thermal treatment of the sample |
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Make a mask on the sample |
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Lithography |
Imprinting |
Transfer pattern into the sample |
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Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
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Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
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Characterize the sample |
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Back end of the sample |
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Chip/die mounting |
Wire bonding |
Dicing |