Specific Process Knowledge: Difference between revisions
Line 93: | Line 93: | ||
|} | |} | ||
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | ||
!Make a mask on the sample [[File:Making a mask 1.jpg| | !Make a mask on the sample [[File:Making a mask 1.jpg|40px]] | ||
! | ! | ||
|- | |- |
Revision as of 14:55, 27 May 2014
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction
Overview of sample processing
Clean the sample |
---|
Drying Samples |
---|
Thermal treatment of the sample |
---|
Make a mask on the sample | |
---|---|
Lithography | |
Imprinting |
Transfer pattern into the sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
---|
Characterize the sample |
---|
Back end of the sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |