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| ===This section is under construction [[Image:section under construction.jpg|70px]] === | | ===This section is under construction [[Image:section under construction.jpg|70px]] === |
| Sample processing:
| | ==Overview of sample processing== |
| {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" | | {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2" align="left" |
| !Clean the sample | | !Clean the sample |
Revision as of 14:16, 27 May 2014
2nd Level - Process Topic
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Choose the process topic you are interested in
This section is under construction 
Overview of sample processing
| Make a layer on the sample
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Thermal Oxide growth
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Thin Film deposition
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Sputter deposition
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Thermal deposition
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E-beam evaporation
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CVD
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LPCVD
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PECVD
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Coating
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Spin coating
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Spray coating
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Electroplating
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Epitaxial growth
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| Thermal treatment of the sample
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| Make a mask on the sample
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Lithography
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Imprinting
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| Transfer pattern into the sample
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| Wet etch
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| Dry etch
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| Lift-off
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| Direct structure definition
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| Imprinting
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| LASER machining
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| Lithographic definition
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| Polymer Injection molding
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| Back end of the sample
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| Chip/die mounting
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| Wire bonding
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| Dicing
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