Specific Process Knowledge: Difference between revisions
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!Direct structure definition | !Direct structure definition | ||
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|Imprinting | |||
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|LASER machining | |||
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|Lithographic definition | |||
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|Polymer Injection molding | |||
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!Bonding samples together | !Bonding samples together | ||
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!Back end of the sample | !Back end of the sample | ||
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|Chip/die mounting | |||
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|Wire bonding | |||
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|Dicing | |||
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Revision as of 14:15, 27 May 2014
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Sample processing:
| Clean the sample |
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| Drying Samples |
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| Make a layer on the sample | ||
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| Thermal Oxide growth | ||
| Thin Film deposition | ||
| Sputter deposition | ||
| Thermal deposition | ||
| E-beam evaporation | ||
| CVD | ||
| LPCVD | ||
| PECVD | ||
| Coating | ||
| Spin coating | ||
| Spray coating | ||
| Electroplating | ||
| Epitaxial growth |
| Thermal treatment of the sample |
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| Make a mask on the sample | |
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| Lithography | |
| Imprinting |
| Transfer pattern into the sample |
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| Wet etch |
| Dry etch |
| Lift-off |
| Direct structure definition |
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| Imprinting |
| LASER machining |
| Lithographic definition |
| Polymer Injection molding |
| Bonding samples together |
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| Characterize the sample |
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| Back end of the sample |
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| Chip/die mounting |
| Wire bonding |
| Dicing |