Specific Process Knowledge: Difference between revisions

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{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Make a mask on the sample
!Make a mask on the sample
!
|-
|
|Lithography
|-
|
|Imprinting
|-
|}
|}
**Lithography
**Imprinting
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Transfer pattern into the sample
!Transfer pattern into the sample
|-
|Wet etch
|-
|Dry etch
|-
|Lift-off
|-
|}
|}
**Wet etch
**Dry etch
**Lift-off
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
!Direct structure definition
!Direct structure definition

Revision as of 15:13, 27 May 2014

2nd Level - Process Topic

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Choose the process topic you are interested in

This section is under construction Section under construction.jpg

Sample processing:

    • Imprinting
    • LASER machining
    • Lithographic definition
    • Polymer Injection molding
    • Chip/die mounting
    • Wire bonding
    • Dicing
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