Specific Process Knowledge: Difference between revisions

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VisualWikitext

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 ===This section is under construction [[Image:section under construction.jpg|70px]] ===
 Sample processing:
-*Clean the sample
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-*Drying Samples
+!Clean the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Drying Samples
+|}
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
 !Make a layer on the sample
 !
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 |}
-*Thermal treatment of the sample
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-*Make a mask on the sample
+!Thermal treatment of the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Make a mask on the sample
+|}
 **Lithography
 **Imprinting
-*Transfer pattern into the sample
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Transfer pattern into the sample
+|}
 **Wet etch
 **Dry etch
 **Lift-off
-*Direct structure definition
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Direct structure definition
+|}
 **Imprinting
 **LASER machining
 **Lithographic definition
 **Polymer Injection molding
-*Bonding samples together
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-*Characterize the sample
+!Bonding samples together
-*Back end of the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Characterize the sample
+|}
+{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
+!Back end of the sample
+|}
 **Chip/die mounting
 **Wire bonding
 **Dicing