Specific Process Knowledge: Difference between revisions

Thermal treatment of the sample
Make a mask on the sample
- Lithography
- Imprinting
Transfer pattern into the sample
- Wet etch
- Dry etch
- Lift-off
Direct structure definition
- Imprinting
- LASER machining
- Lithographic definition
- Polymer Injection molding
Bonding samples together
Characterize the sample
Back end of the sample
- Chip/die mounting
- Wire bonding
- Dicing

@@ Line 38: / Line 38: @@
 *Clean the sample
 *Drying Samples
-*Make a layer on the sample
-**Thermal Oxide growth
 {| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
-! Col1_head
-! gkraetj
+!Make a layer on the sample
+!
+!
+|-
+|
+|Thermal Oxide growth
+|
 |-
-|Col1_row
+|
-|nvkwo
+|Thin Film deposition
+|
+|-
+|
+|
+|Sputter deposition
+|-
+|
+|
+|Thermal deposition
+|-
+|
+|
+|E-beam evaporation
+|-
+|
+|CVD
+|
+|-
+|
+|
+|LPCVD
+|-
+|
+|
+|PECVD
+|-
+|
+|Coating
+|
+|-
+|
+|
+|Spin coating
+|-
+|
+|
+|Spray coating
+|-
+|
+|Electroplating
+|
+|-
+|
+|Epitaxial growth
 |-
-|askldjg
-|asldtkhj
 |}
-**Thin Film deposition
-***PVD
-****Sputter deposition
-****Thermal deposition
-****E-beam evaporation
-***CVD
-****LPCVD
-****PECVD
-***Coating
-****Spin coating
-****Spray coating
-****Electroplating
-**Epitaxial growth
 *Thermal treatment of the sample
 *Make a mask on the sample