Specific Process Knowledge: Difference between revisions
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*[[/Imprinting|Imprinting]] | *[[/Imprinting|Imprinting]] | ||
*[[/Lithography|Lithography]] - | *[[/Lithography|Lithography]] | ||
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*[[/Photolithography|Photolithography]] | *[[/Photolithography|Photolithography]] | ||
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*[[/Thermal Process|Thermal Process]] | *[[/Thermal Process|Thermal Process]] |
Revision as of 12:06, 2 May 2014
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Choose the process topic you are interested in
This section is under construction
Sample processing:
- Clean the sample
- Drying Samples
- Make a layer on the sample
- Thermal Oxide growth
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- Thin Film deposition
- PVD
- Sputter deposition
- Thermal deposition
- E-beam evaporation
- CVD
- LPCVD
- PECVD
- Coating
- Spin coating
- Spray coating
- Electroplating
- PVD
- Epitaxial growth
- Thin Film deposition
- Thermal treatment of the sample
- Make a mask on the sample
- Lithography
- Imprinting
- Transfer pattern into the sample
- Wet etch
- Dry etch
- Lift-off
- Direct structure definition
- Imprinting
- LASER machining
- Lithographic definition
- Polymer Injection molding
- Bonding samples together
- Characterize the sample
- Back end of the sample
- Chip/die mounting
- Wire bonding
- Dicing