Specific Process Knowledge: Difference between revisions
| Line 38: | Line 38: | ||
*Drying Samples | *Drying Samples | ||
*Make a layer on the sample | *Make a layer on the sample | ||
*Thermal Oxide growth | **Thermal Oxide growth | ||
**PVD | **Thin Film deposition | ||
***Sputter deposition | ***PVD | ||
***Thermal deposition | ****Sputter deposition | ||
***E-beam evaporation | ****Thermal deposition | ||
**CVD | ****E-beam evaporation | ||
***LPCVD | ***CVD | ||
***PECVD | ****LPCVD | ||
**Coating | ****PECVD | ||
***Spin coating | ***Coating | ||
***Spray coating | ****Spin coating | ||
***Electroplating | ****Spray coating | ||
****Electroplating | |||
**Epitaxial growth | |||
*Thermal treatment of the sample | *Thermal treatment of the sample | ||
*Make a mask on the sample | *Make a mask on the sample | ||
Revision as of 12:38, 30 April 2014
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Sample processing:
- Clean the sample
- Drying Samples
- Make a layer on the sample
- Thermal Oxide growth
- Thin Film deposition
- PVD
- Sputter deposition
- Thermal deposition
- E-beam evaporation
- CVD
- LPCVD
- PECVD
- Coating
- Spin coating
- Spray coating
- Electroplating
- PVD
- Epitaxial growth
- Thermal treatment of the sample
- Make a mask on the sample
- Lithography
- Imprinting
- Transfer pattern into the sample
- Wet etch
- Dry etch
- Lift-off
- Direct structure definition
- Imprinting
- LASER machining
- Lithographic definition
- Polymer Injection molding
- Bonding samples together
- Characterize the sample
- Back end of the sample
- Chip/die mounting
- Wire bonding
- Dicing