Specific Process Knowledge: Difference between revisions

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===This section is under construction [[Image:section under construction.jpg|70px]] ===
===This section is under construction [[Image:section under construction.jpg|70px]] ===
Sample processing:
*Clean the sample
*Drying Samples
*Make a layer on the sample
*Thermal Oxide growth
**PVD
***Sputter deposition
***Thermal deposition
***E-beam evaporation
**CVD
***LPCVD
***PECVD
**Coating
***Spin coating
***Spray coating
***Electroplating
***Epitaxial growth
*Thermal treatment of the sample
*Make a mask on the sample
**Lithography
**Imprinting
*Transfer pattern into the sample
**Wet etch
**Dry etch
**Lift-off
*Direct structure definition
**Imprinting
**LASER machining
**Lithographic definition
**Polymer Injection molding
*Bonding samples together
*Characterize the sample
*Back end of the sample
**Chip/die mounting
**Wire bonding
**Dicing

Revision as of 12:35, 30 April 2014

2nd Level - Process Topic

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This section is under construction

Sample processing:

  • Clean the sample
  • Drying Samples
  • Make a layer on the sample
  • Thermal Oxide growth
    • PVD
      • Sputter deposition
      • Thermal deposition
      • E-beam evaporation
    • CVD
      • LPCVD
      • PECVD
    • Coating
      • Spin coating
      • Spray coating
      • Electroplating
      • Epitaxial growth
  • Thermal treatment of the sample
  • Make a mask on the sample
    • Lithography
    • Imprinting
  • Transfer pattern into the sample
    • Wet etch
    • Dry etch
    • Lift-off
  • Direct structure definition
    • Imprinting
    • LASER machining
    • Lithographic definition
    • Polymer Injection molding
  • Bonding samples together
  • Characterize the sample
  • Back end of the sample
    • Chip/die mounting
    • Wire bonding
    • Dicing