Specific Process Knowledge: Difference between revisions
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===This section is under construction [[Image:section under construction.jpg|70px]] === | ===This section is under construction [[Image:section under construction.jpg|70px]] === | ||
Sample processing: | |||
*Clean the sample | |||
*Drying Samples | |||
*Make a layer on the sample | |||
*Thermal Oxide growth | |||
**PVD | |||
***Sputter deposition | |||
***Thermal deposition | |||
***E-beam evaporation | |||
**CVD | |||
***LPCVD | |||
***PECVD | |||
**Coating | |||
***Spin coating | |||
***Spray coating | |||
***Electroplating | |||
***Epitaxial growth | |||
*Thermal treatment of the sample | |||
*Make a mask on the sample | |||
**Lithography | |||
**Imprinting | |||
*Transfer pattern into the sample | |||
**Wet etch | |||
**Dry etch | |||
**Lift-off | |||
*Direct structure definition | |||
**Imprinting | |||
**LASER machining | |||
**Lithographic definition | |||
**Polymer Injection molding | |||
*Bonding samples together | |||
*Characterize the sample | |||
*Back end of the sample | |||
**Chip/die mounting | |||
**Wire bonding | |||
**Dicing | |||