Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:LightGrey; color:black"|Patterning, milling and dicing substrates | |style="background:LightGrey; color:black"|Patterning, milling and dicing substrates | ||
|style="background:WhiteSmoke; color:black"|Mainly for patterning, milling | |style="background:WhiteSmoke; color:black"|Mainly for patterning, milling, drilling with high aspect ratio and dicing substrate with micrometric shapes and above (> 10µm) | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan="4"|Performances | !style="background:silver; color:black" align="left" valign="top" rowspan="4"|Performances | ||