Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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|[[media:AR-N7500-7520.pdf|AR-N7500-7520.pdf]] | |[[media:AR-N7500-7520.pdf|AR-N7500-7520.pdf]] | ||
|[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]] | |[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]] | ||
| | |AR 300-47, TMAH | ||
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= Alignment of exposure to existing pattern on wafer = | = Alignment of exposure to existing pattern on wafer = | ||