Specific Process Knowledge/Lithography/ZEP520A: Difference between revisions
Created page with "These tests are currently in progress and this page thus under construction. If you have questions to the process or wish to use this e-beam resist, please contact Tine Greibe..." |
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== Process Flow == | == Process Flow == | ||
Test of | Test of ZEP resist; a positive e-beam resist from ZEON. | ||
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" | {|border="1" cellspacing="0" cellpadding="3" style="text-align:left;" | ||
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|No Pretreatment | |No Pretreatment | ||
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|TIGRE, | |TIGRE, 23-04-2014 | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|Spin Coater Manual, LabSpin, A-5 | |Spin Coater Manual, LabSpin, A-5 | ||
| | |ZEP520A 1:1 E-beam resist | ||
60 sec at various spin speed. | 60 sec at various spin speed. | ||
Acceleration 4000 s-2, | Acceleration 4000 s-2, | ||
softbake | softbake 2 min at 180 deg Celcius | ||
|Resist poured directly from bottle | |Resist poured directly from bottle | ||
|TIGRE, | |TIGRE, 23-04-2014 | ||
|- | |- | ||
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|9 points measured on 100 mm wafer | |9 points measured on 100 mm wafer | ||
|ZEP program used; measured at 70 deg only | |ZEP program used; measured at 70 deg only | ||
|TIGRE, | |TIGRE, 23-04-2014 | ||
|- | |- | ||
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dose 120-280 muC/cm2 | dose 120-280 muC/cm2 | ||
|Virtual chip mark height detection | |Virtual chip mark height detection | ||
| TIGRE, | | TIGRE, 23-04-2014 | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|Fumehood, D-3 | |Fumehood, D-3 | ||
|60 sec in | |60 sec in , | ||
60 sec rinse in IPA, | 60 sec rinse in IPA, | ||
N2 Blow dry | N2 Blow dry | ||
|Agitation (by hand) while developing | |Agitation (by hand) while developing | ||
| TIGRE, | | TIGRE, XX-04-2014 | ||
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== Spin Curve == | == Spin Curve == | ||
Revision as of 11:42, 23 April 2014
These tests are currently in progress and this page thus under construction. If you have questions to the process or wish to use this e-beam resist, please contact Tine Greibe at tigre@danchip.dtu.dk.
Process Flow
Test of ZEP resist; a positive e-beam resist from ZEON.
| Equipment | Process Parameters | Comments | Initials and date |
|---|---|---|---|
| Pretreatment | |||
| 4" Si wafers | No Pretreatment | TIGRE, 23-04-2014 | |
| Spin Coat | |||
| Spin Coater Manual, LabSpin, A-5 | ZEP520A 1:1 E-beam resist
60 sec at various spin speed. Acceleration 4000 s-2, softbake 2 min at 180 deg Celcius |
Resist poured directly from bottle | TIGRE, 23-04-2014 |
| Characterization | |||
| Ellipsometer VASE B-1 | 9 points measured on 100 mm wafer | ZEP program used; measured at 70 deg only | TIGRE, 23-04-2014 |
| E-beam Exposure | |||
| JEOL 9500 E-beam writer, E-1 | Dosepattern 14nm - 100nm,
dose 120-280 muC/cm2 |
Virtual chip mark height detection | TIGRE, 23-04-2014 |
| Development | |||
| Fumehood, D-3 | 60 sec in ,
60 sec rinse in IPA, N2 Blow dry |
Agitation (by hand) while developing | TIGRE, XX-04-2014 |
| Characterization | |||
| Zeiss SEM Supra 60VP, D-3 | TIGRE, ??-04-2014 | ||
Spin Curve
The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only. 9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.
| AllResist AR-P 6200/2 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 09-04-2014 | ||||||
|---|---|---|---|---|---|---|
| Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
| 2000 | 4000 | 225.98 | 0.97 | |||
| 3000 | 4000 | 194.00 | 0.6 | |||
| 4000 | 4000 | 169.57 | 0.32 | |||
| 5000 | 4000 | 151.47 | 0.26 | |||
| 6000 | 4000 | 142.38 | 0.41 | |||
| 7000 | 4000 | 126.59 | 0.36 | |||