Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])

! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])

! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Hummer_Sputter_coater|Hummer]]   

! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#The_Balzer_Sputter_coater|Balzer]]

|-style="background:WhiteSmoke; color:black"

| E-beam deposition of Au

| Sputter deposition of Au

| Sputter deposition of Au

| Sputter deposition of Au

|RF Ar clean

|RF Ar clean

|

|

|-style="background:WhiteSmoke; color:black"

! Layer thickness

|10 Å to 5000Å*

|10 Å to

|

|

|-

|-style="background:LightGrey; color:black"

|1 Å/s to 10 Å/s

|

|Not measured

|Not measured

|-

*1x4" wafer or

*1x6" wafer

|

*1x4" wafer

*1 large sample (< 4" wafer)

*Several smaller samples

|-

* Metals  

* Carbon

|.

|.

|-style="background:WhiteSmoke; color:black"

* An adhesion layer (of Cr or Ti) is recommended under Au.

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|Used to gold sputter coating of   

samples mainly before SEM characterization  

|Used to gold sputter coating of  

samples mainly before SEM characterization

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|}