Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
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At DANCHIP you can also deposit silicon using Wordentec, PVD co-sputter/evaporation or IBE Ionfab300 sputter systems. (There is also a Si sputter target in Alcatel, but the process is not running stable nowadays). One of the advantages here is that you can deposit on any material you like. | At DANCHIP you can also deposit silicon using Wordentec, PVD co-sputter/evaporation or IBE Ionfab300 sputter systems. (There is also a Si sputter target in Alcatel, but the process is not running stable nowadays). One of the advantages here is that you can deposit on any material you like. | ||
* [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBSD of Si|Si deposition in IBE⁄IBSD Ionfab300]] | |||
* [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter in Wordentec]] | * [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter in Wordentec]] | ||
* [[Specific Process Knowledge/Thin film deposition/Si sputter in PVD co-sputter/evaporation|Si sputter in PVD co-sputter/evaporation]] | * [[Specific Process Knowledge/Thin film deposition/Si sputter in PVD co-sputter/evaporation|Si sputter in PVD co-sputter/evaporation]] | ||