Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

Revision as of 09:07, 2 April 2014 view source Knil (talk \| contribs) DCH-Employees-701 420 edits No edit summary ← Older edit		Revision as of 15:21, 16 January 2017 view source Mdyma (talk \| contribs) danchip 584 edits →Silicon sputter Newer edit →
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	Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.		Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.

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