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| All cleanroom materials. | | All cleanroom materials. |
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| |style="background:LightGrey; color:black"|Batch
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 1
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| <br clear="all" />
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| ==III-V Spinner==
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| [[Image:3-5 spinner.jpg|300x300px|thumb|III-V Spinner positioned in A-5]]
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| '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#III-V_Spinner click here]'''
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| The III-V spinner is a SÜSS RC8 Spin Coater intended for processing of III-V compound semiconductors and CMOS compatible materals. Please note, that '''there are different chucks for III-V materials and Si-, SiO2-materials.''' The spinner is mounted in a flow hood located in the III-V laboratory (yellow room). The extra exhaust should always be turned on while spinning.
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| '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=140 LabManager]'''
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| <br clear="all" />
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| === Equipment performance and process related parameters ===
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| {| border="2" cellspacing="0" cellpadding="2"
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| !style="background:silver; color:black;" align="center" width="60"|Purpose
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black"|
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| *Spin coating and soft baking UV sensative resists
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| *Spin coating E-beam resits
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| !style="background:silver; color:black;" align="center" width="60"|Resist
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| |style="background:LightGrey; color:black"|
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * AZ5214E manual dispense
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| * E-beam resits manual dispense
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| !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
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| |style="background:LightGrey; color:black"|Coating thickness
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * AZ5214E 1-4,2 µm
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| * E-beam resits 0,1-1 µm
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
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| |style="background:LightGrey; color:black"|Spin speed
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| *Cover closed: 7000 rpm
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| *Cover open: 1000 rpm
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| * Gyrset: 3000 rpm
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| * non-vaccum chuck: 5000 rpm
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| |style="background:LightGrey; color:black"|Spin acceleration
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| 100 - 5000 rpm/s
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| |style="background:LightGrey; color:black"|Hotplate temperature
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| |style="background:WhiteSmoke; color:black" align="center"|
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| * 90° for III-V materials
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| * 110° for III-V materials
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| * changeable temperature from 20°-200° for other materials
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| !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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| |style="background:LightGrey; color:black"|Substrate size
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| * 50 mm wafers
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| * 100 mm wafers
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| * 150 mm wafers
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| * small pieces down to 3x3 mm2
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| | style="background:LightGrey; color:black"|Allowed materials
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| |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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| All cleanroom materials.
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| Please notice that III-V materials need to be run on the dedicated chuck!
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| |style="background:LightGrey; color:black"|Batch | | |style="background:LightGrey; color:black"|Batch |
