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Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Elkh (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
343 edits
Line 224: Line 224:
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:LightGrey; color:black"|Hotplate temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
*175°C for BARC baking
*130°C for positive tone resist soft baking and post exposure baking
*130°C for positive tone resist soft baking and post exposure baking
*100°C for negative tone resist soft baking and  post exposure baking
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