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Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions

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*Development of ...
*Development of DUV resist: KRF 230Y and KRF M35G
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!style="background:silver; color:black;" align="center" width="60"|Resist
!style="background:silver; color:black;" align="center" width="60"|Developer
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*BARC DUV42S-6
2,38% water based TMAH
*Positive tone resist KRF M230Y
*Positive tone resist KRF M35G
*Negative tone resist UVN2300-0.8
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!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|Coating thickness
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*BARC DUV42S-6 around 60nm
*Positive tone resist KRF M230Y 300-600nm
*Positive tone resist KRF M35G 800-1600nm
*Negative tone resist UVN2300-0.8 200-1400nm
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Spin speed