Specific Process Knowledge/Characterization/Element analysis: Difference between revisions

!width="250" style="background:silver; color:black" | XPS

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! style="background:WhiteSmoke; color:black" | Energy Dispersive X-ray Analysis

! style="background:WhiteSmoke; color:black" | Secondary Ion Mass Spectroscopy

! style="background:WhiteSmoke; color:black" | X-ray Photoelectron Spectroscopy

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| style="background:lightgrey; color:black"  | Non destructive method: X-rays are generated when the primary beam impinges on the sample. The elemental analysis is possible because the energy of these X-rays is characteristic of the element they emitted from.

| style="background:lightgrey; color:black" | Destructive method: A beam of high energy heavy ions (caesium or oxygen) sputters off surface atoms that are subsequently measured with a mass spectrometer.  

| style="background:lightgrey; color:black" | Non destrucive method: X-rays are irridiating the sample, and the energy of edjected photoelectrons is measured. The elemental analysis is possible, since the binding energy of the electrons (and hence the energy of the emitted photoelectrons) are specific for each element.

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| style="background:WhiteSmoke; color:black" | Every element heavier than boron/carbon  

| style="background:WhiteSmoke; color:black" | Every element

| style="background:WhiteSmoke; color:black" | Every element except hydrogen and helium. However, the signal from two substances can overlapp, which can reduce the detection limit  

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|style="background:lightgrey; color:black"| None: Only transistions involving inner shell electrons are detected

|style="background:lightgrey; color:black"| None

|style="background:lightgrey; color:black"| Chemical state information

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| style="background:WhiteSmoke; color:black" | Vacuum compatible.

| style="background:WhiteSmoke; color:black" | Vacuum compatible. The sample needs to be cut into small (app. 5*5 mm) pieces.

| style="background:WhiteSmoke; color:black" | Vacuum compatible. Sample size max 50x50 mm, thickness max 20 mm.

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|style="background:lightgrey; color:black"| Very precise point-like analysis is possible with SEM electron beam.

|style="background:lightgrey; color:black"| Limited to what is visible in a camera

|style="background:lightgrey; color:black"| Limited to what is visible in a camera

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| style="background:WhiteSmoke; color:black" | The size interaction volume depends on the SEM high voltage and sample density: The higher the SEM high voltage the bigger and deeper the interaction volume. The more dense the material is the smaller is the interaction volume. See section 'Spatial resolution using EDX' below.

| style="background:WhiteSmoke; color:black" | The sputtering of the surface makes it possible to perform detailed depth profiling with extremely good sensitivity and depth resolution.

| style="background:WhiteSmoke; color:black" | Very surface sensitive technique. Signal only from the top layer (a few nanometers deep) can be detected. By using the ion beam etch, the composition of deeper lying layers can be probed.  

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|style="background:lightgrey; color:black"| Approximately 1 % atomic weight

|style="background:lightgrey; color:black"| Down to 1 ppb for many elements

|style="background:lightgrey; color:black"| Approximately 1 % atomic weight

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| style="background:WhiteSmoke; color:black" | Quite fast and easy  

| style="background:WhiteSmoke; color:black" | Time consuming