Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
Line 34: | Line 34: | ||
Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||
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Unmasked - used as a stripper | |||
|- | |- | ||
|Etch rate | |Etch rate | ||
| | | | ||
~100 nm/min | ~100 nm/min | ||
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~(??) nm/min | ~(??) nm/min |
Revision as of 09:56, 31 January 2008
Etching of Gold
Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions:
- Iodine etch: KI:I:HO - 400g:100g:400ml?
- Aqua Regia (Kongevand): HNO:HCl - 1:3
Comparing the two solutions
Iodine based gold etch | Aqua Regia (Kongevand) | |
---|---|---|
General description |
Etch of pure Gold |
Etch of pure Gold |
Chemical solution | KJ:J:HO (100g:25g:500ml) | HCl:HNO (3:1) |
Process temperature | 20 oC | 20 oC |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Unmasked - used as a stripper |
Etch rate |
~100 nm/min |
~(??) nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
2-6" wafers |
2-6" wafers |