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Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions

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2-6" wafers
2-6" wafers
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|-
|Allowed materials
|
*Aluminium
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
|
*Aluminium
*Silicon
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
|-
|}
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