Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
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|Size of substrate | |Size of substrate | ||
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2-6" wafers | |||
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2-6" wafers | |||
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|Allowed materials | |Allowed materials |
Revision as of 15:14, 18 January 2008
Etching of Gold
Etching of Gold is done wet at Danchip making your own set up in the fumehood. We have two different solutions:
- Iodine etch: KI:IFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O - 400g:100g:400ml?
- Aqua Regia (Kongevand): HNO:HCl - 1:3
Comparing the two solutions
Iodine based gold etch | Aqua Regia (Kongevand) | |
---|---|---|
General description |
Etch of pure Gold |
Etch of pure Gold |
Chemical solution | KJ:JFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O (100g:25g:500ml) | HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle Cl} :HOFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3} (3:1) |
Process temperature | 20 oC | 20 oC |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
Etch rate |
~100 nm/min (Pure Al) |
~(??) nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
2-6" wafers |
2-6" wafers |
Allowed materials |
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