Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
| Line 187: | Line 187: | ||
[[Image:Gamma_2M_dev.jpg|200×200px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3]] | [[Image:Gamma_2M_dev.jpg|200×200px|right|thumb|The SÜSS Spinner-Stepper is placed in F-3]] | ||
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/DUVStepperLithography# | '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper click here]''' | ||
This developer is dedicated for development of DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size. The machine is equipped with the 3 resist lines, an automatic syringe system and a solvent line for cleaning and back-side rinse. | This developer is dedicated for development of DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size. The machine is equipped with the 3 resist lines, an automatic syringe system and a solvent line for cleaning and back-side rinse. | ||