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Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions

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'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer TMAH Stepper click here]'''
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer TMAH Stepper click here]'''


This developer is dedicated for developing DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size. The machine is equipped with the 3 resist lines, an automatic syringe system and a solvent line for cleaning and back-side rinse.
This developer is dedicated for development of DUV resists. The developer is fully automatic and can run up to 25 substrates in a batch  4", 6", and 8" size. The machine is equipped with the 3 resist lines, an automatic syringe system and a solvent line for cleaning and back-side rinse.
   
   
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
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*Spin coating and soft baking of BARC
*Development of ...
*Spin coating and soft baking of DUV resists
*Post exposure baking
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