Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
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Etch of pure Gold | Etch of pure Gold | ||
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Etch of Gold | Etch of pure Gold | ||
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|Chemical solution | |Chemical solution |
Revision as of 15:51, 17 January 2008
Etching of Gold
Etching of Gold is done wet at Danchip. We have two different solutions:
- KI:I:HO - 400g:100g:400ml?
- HNO:HCl - 1:3
Comparing the two solutions
Iodine based gold etch | Aqua Regia (Kongevand) | |
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General description |
Etch of pure Gold |
Etch of pure Gold |
Chemical solution | HO:HPO 1:2 | PES 77-19-04 |
Process temperature | 50 oC | 20 oC |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
Etch rate |
~100 nm/min (Pure Al) |
~60(??) nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
4" wafers |
4" wafers |
Allowed materials |
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